1. Introduction and Overview of nanotechnology

这是一篇关于1. Introduction and Overview o的思维导图，主要内容包括：Applications of Nanotechnology to Devices and Microsystems，Scaling Devices to Nanometer Range，Why Nanotechnology for Advanced Microelectronics and Bi

1. Introduction and Overview of Nanotechnology

• Why Nanotechnology for Advanced Microelectronics and Biosystems
  • Integrated Circuits (ICs)＜10nm
    • Become Smaller with Higher Performance, Lower Power and Cost
    • New technology, new materials and new designs
  • generate Biosensors
• Scaling Devices to Nanometer Range
  • Moore's Law
    • Transistor density doubled every 2 years
      • Nanotechnology brings Faster, Cheaper, and Lower Energy Computers
  • limitations
    • Heat dissipation
      • High Heating Power Density due to Densely Packed Transistors, which will Damage and Slow Down ICs
        • Extensive Cooling is needed in IC Packages
    • Atomic Size
      • With 45 nm Gate Length, already required 1.2 nm SiO2 (Few Atoms) for Scaling. It's difficult to control below single atom(Gate length 3nm)
• Applications of Nanotechnology to Devices and Microsystems
  • new design
    • FinFET – Gate contacts 3 Sides around Channel to provide Better Control
    • Gate-All-Around – Gate contacts Channels from All 4 sides with Multiple Layers of Nanosheets to reduce Leakage and provide needed Current
  • Nanoimprint
    • applications
      • Imprinting on Metal and Ceramic
      • Modes of Reversal Imprinting
      • Imprinting on Flexible Substrate
        • Substrates that Cannot be Easily Spin-Coated - Flexible Polymer Films - Plastic Electronics
      • 3D Patterning by Repeated Imprinting
        • Multiple Layer 3D Nanostructures
      • Imprinted 3-d Grating With Sealed Cavities
      • Nanochannels
        • 4 Repeated Reversal Imprints
          • Uniform Array and Multiple Levels of 3D Nanochannels Formed by Repeating Reversal UV Nanoimprint
        • Integrated Channels with Electrodes for Stretched DNA and Protein Interaction
          • Image Single Protein Molecules Bound to Single DNA Molecules
            • DNA Motion Induced in Si Channels by Applied Voltage due to ac Field
        • High Aspect Ratio, Thick Si Microheater
          • Generate Large Volume for Absorbents
            • Thick Microheater Filled with Different Adsorbent Granules for 3-stage μPCF
              • Wide Range, High Sensitivity, Obtaine Chromatogram of 30 Compounds
    • Surface Energy Control For Reversal Imprint
      • Surface Energy Can be Controlled by Silanes or Plasma
      • Silanes Can be Mixed in Various Ratio for Desired Surface Energy
    • Nanoimprint over Large Areas for Cell Growth(on Imprinted Polystyrene Gratings PS Gratings), Cells Aligned and Elongated on PS Gratings (Increase with Reduced Grating Width)
  • Stacking Nanosquares
    • Photonic Crystal Defects could be Generated after Stacking Nanosquares on top of Nanoholes
      • Point Defect Generated by Missing Nanosquares Directly on Top of Nanoholes
  • 3D Nanoplasmonic Biosensor with Microposts for Detection of Filopodia in Cells
    • Highest Separation Efficiency of 99.4% was Achieved on Selectively Coated Platforms
  • THz Open Resonance Antenna (ORA) with ME Dipole, Spherical Concave Surface, and Silicon Partially Reflective Surface
  • Compact Terahertz Dielectric Folded Metasurface
    • Dielectric Material in Si Avoids Metallic Loss to provide High Efficiency
    • High Gain and Low Profile THz Antenna by Two Parallel Metasurfaces
  • Nanotechnology Requirements
    • Low Temperature, Low Pressure, High Throughput, and Flexible Patterning of 3D Nanostructures in Si, Polymer, Oxide, and Metal - Channels, Cavities, Sidewalls, Scaffolds, Microfluidic Systems with Interconnects
    • Can be Apply to Fabricate Electronic & Photonic Devices, Sensors, Actuators, and Biomedical Microsystems
    • Low Damage and Precise Control are Needed for NanoDevices and Systems to Achieve High Performance
  • Key Technology Challenges
    • Patterning Technology
    • Materials
    • 子主题
• Transistors
  • Integrating Many Transistors Together – Lower Cost, More functions
  • Gate, Source, and Drain to replace
• Vacuum Tubes
  • Dimensions and Large Integration have Advantages of Higher Speed, Multiple Functions, Lower Power, and Lower Cost
• cleanroom
  • class 1000/100 room
    • figures represent the how many particles there in the clean room
      • electrons will combine the molecules to creat defects
  • requirements
    • wear clearoom clothing
      • to reduce particles in the environment to minimize defects in devices
  • Technologies
    • lithography
    • Photolithography(0.5um)
    • Electron Beam Lithography(10nm)
      • only the one can draw various patterns
    • Nanoimprint Lithography(1nm)
      • advantages
        • high resolution
        • high throughput
        • Simple Patterning System – Resolution not limited by Photons or Beams
        • 3D Patterning over Topography
        • Patterning Directly in Functional Materials to Simplify Process(e.g. Metal, Flexible Film)
    • Deposition
    • Etching
      • High Density, Self-aligned Si Field Emitters, Sharp Tips Formed by Dry Etching with Mask Erosion
    • Metrology Equipment
  • yellow room
    • light will change the pattern(photosensitive materials) except yellow colour